Production of Printed Circuit Boards - production parameters

Type of laminate:

Aluminum pcb, FR-4(1-12 warstw),HDI,FPC,Rigid Flex

Thickness of laminate:

0,01 - 0,20 inches

Thickness of copper:

1/3oz-8oz

Maximum size of the boards:

17,72 *47,24 inches

Minimum production format:

0,16 -0,16 inches

Minimum distance between tracks:

3mil

Quantity of layers:

12

Heat conductibility:

Aluminum pcb 0.8-4.0W/m·K

Final copper thickness on the external layers [µm]:

8oz

Final copper thickness on the internal layers [µm]:

5oz

Colour of the antisoldering mask from the element's side (TOP):

black, white, red, yellow, green, blue, purple, coffee

Colour of the antisoldering mask from the soldering side (BOT):

black, white, red, yellow, green, blue, purple, coffee

Description colours from the element's side (TOP):

black, white, red, yellow, green

Description colours from the soldering side:

black, white, red, yellow, green, blue, purple, coffee

Gold, HAL covering:

Soldering:

leaded soldering, unleaded Hasl, gold electrolytic, tin electrolytic submersion, electrolytic silver, OSP (Organic Solderability Preservative), colophony, blue adhesive

Mechanical treatment:

milling, gravering, blind vias, beveling

Final minimum of the aperture diameter [mm]:

12:1

Minimum distance between tracks:

3mil

Minimum annulus [mils]:

HDI single side 0,01 inch

Addendums:

detachable mask , UL certificate,ISO14001, TS16949

Documentation:

protel99se pads dxp P-cad2006 AutoCad